| Theelectronicpackageisamulti-layeredstructurethatisconsistedofseveralmaterials.Underthetemperatureloadings,theinterfacialstressesbetweenlayeredcomponentsaregeneratedduetotheCTE(coefficientofthermalexpansion)mismatchbetweendifferentmaterials.Indiebondingprocess,thevoidordefectmightexistatthedieattach/diepaddleinterface.Thevoidcausefurtherdelaminationontheinterfaceduringtheencapsulationprocess.Inthisstudy,thefiniteelementmethodisusedtoconstructthemodelofelectronicpackagewithavoidonthedieattach/diepaddleinterface.TheenergyreleaseratebasedonJintegration,whichiscalculatedbythestressandstrainaroundthetipofcrack,isusedasadamageparametertopredictthetendencyoffurtherdelaminationduringencapsulation.Effectofmaterialproperties(Young’smodulusandCTE)anddieattachthicknessondelaminationofdieattach/diepaddleinterfaceinpackageduringencapsulationisstudied. |